The leaked images of the cases manufacturer in China appears like an affirming the design of HTC’s next flagship device One (M9). The photographs of the One M9 have leaked a few times in the recent days.
As demonstrated in the picture above, one can plainly see the particularly shaped camera of the approaching handset. The smartphone is required to bundle in a 20.7-megapixel camera sensor.
The back case design additionally demonstrates that the power/lock button of HTC Hima is located on its right side while the HTC One (M7) and One (M8) had it put on top. The case opening on top in the photographs will probably help in the working of IR blaster (Infrared blaster).
HTC One (M9) will be announced officially on March 1 amid Mobile World Congress (MWC), which will be held in Barcelona. The leaked specifications of the One M9 includes Qualcomm Snapdragon 810 Soc, 3GB of RAM, 5 inch 1080p display and a 20.7-megapixel primary camera.